| >> structured passivations | |
|
hermetic optical transparent sealing of surfaces against environmental, chemical or mechanical impacts e.g. for windowless packages of highly reliable devices for automotive and defense, optical components, power devices | ![]() |
| >> wafer-level-capping | |
|
encapsulation of the active area of the devices with bonded cavity glass caps e.g. for image sensors, photo detectors, MEMS | ![]() |
| >> functional layers | |
|
employing the temperature and long-term stable material properties of the deposited glass layers e.g. power transistors, HF components, SAW filters, integrated passives, DOE | ![]() |
| >> micro fluidics, Bio-MEMS | |
|
moisture and temperature stable surfaces, cavity structures and channels in glass e.g. medical surfaces and electronics, lab-on-chip | ![]() |
| >> and many more... |







