Meet us:

SMT Hybrid Packaging

Nuremberg, Germany
April 16 - 18
Booth 6-115G


Las Vegas, NV USA
May 28 - 31
Applications / Products

>> structured passivations

hermetic optical transparent sealing of surfaces against environmental, chemical or mechanical impacts

e.g. for windowless packages of highly reliable devices for automotive and defense, optical components, power devices


>> wafer-level-capping

encapsulation of the active area of the devices with bonded cavity glass caps

e.g. for image sensors, photo detectors, MEMS


>> functional layers

employing the temperature and long-term stable material properties of the deposited glass layers

e.g. power transistors, HF components, SAW filters, integrated passives, DOE


>> micro fluidics, Bio-MEMS

moisture and temperature stable surfaces, cavity structures and channels in glass

e.g. medical surfaces and electronics, lab-on-chip


>> and many more...