Meet us:


Santa Clara, CA, USA
Aug 2-3


Grenoble, France
Sept 20-22
Booth 12
News
27-29. June 2017 - Sensors Expo in San Jose, CA, USA

Exhibiting at booth 329
McEnery Convention Censter, San Jose, CA, USA


30. May -1. June 2017 - Sensor+Test in Nuremberg, Germany

Exhibiting at booth 1-324/429 with the Sensorik Bavaria Network
Messezentrum Nuremberg, Germany


31. Jan - 02. Feb. 2017 -Photonics West in San Francisco, CA, USA

Exhibiting at booth 4143
Moscone Convention Center, 747 Howard St, San Francisco, CA 94103, USA


18-20. Jan. 2017 - Nepcon Japan in Tokyo, Japan

Exhibiting at the booth of ADY
Tokyo Big Sight, Japan


25-27. Oct. 2016 - Semicon Europa in Grenoble, France

Exhibiting at the booth of Silicon Saxony, Hall 1, Booth 1125
AlpExpo, Grenoble, France


2-7. Oct. 2016 - ECS PRiME 2016 in Honolulu, Hawaii, USA

Keynote:
MEMS Capping By Anodic Bonding of Evaporated Glass Thin Films


15-16. Sept. 2016 - European MEMS Summit in Stuttgart, Germany

Maritim Hotel Stuttgart, Seidenstraße 34, 70174 Stuttgart


14-16. Sept. 2016 - MEMS Sensing in Yokohama, Japan

Exhibiting with our partner ADY
Pacifico Yokohama, Booth S-4C


7-9. Sept. 2016 - Semicon Taiwan in Taipei, Taiwan

Exhibiting with STC (Standard Technology Corporation)
Taipei Nangang Exhibition Center, Hall 4, Booth 226


22-23. June 2016 - Sensors Expo in San Jose, CA, USA

Exhibiting at booth 544
McEnery Convention Censter, San Jose, CA, USA


10-12. May 2016 - Sensor+Test in Nuremberg, Germany

Exhibiting at booth 1-324 with the Sensorik Bavaria Network
Messezentrum Nuremberg, Germany


26-28. Apr. 2016 - Semicon South-East Asia in Penang, Malaysia

Exhibiting at booth C117 with Silicon Saxony
SPICE Arena, Jalan Tun Dr. Awang, Relau, 11900, Pulau Pinang, Penang, Malaysia


16-18. Feb. 2016 - Photonics West in San Francisco, CA, USA

Exhibiting at booth 4265
Moscone Convention Center, 747 Howard St, San Francisco, CA 94103, USA


13-15. Jan. 2016 - Nepcon Japan in Tokyo, Japan

Exhibiting at the booth of ADY
Tokyo Big Sight, Japan


8-9. Dec. 2015 - Waferbond Conference in Braunschweig, Germany

our contribution:
Anodic Bonding using Evaporated Borosilicate Glass Thin-Films


3. Nov. 2015 - Deloitte Fast 50 Award 2015

Lithoglas is winner of the Deloitte Fast 50 award
ranking in the top 10 of the fifty fastest growing German technology companies.


Download our press release: english english
Lithoglas® - Manufacturer of ultra-thin glass for opto-electronic sensors, LEDs, and MEMS components recognized for marketing leadership and innovation.


4-6. Oct. 2015 - Semicon Europa in Dresden, Germany

Exhibiting at the booth of Silicon Saxony, Hall 1, Booth 2046
MESSE DRESDEN, Messering 6, 01067 Dresden, Germany


17-18. Sept. 2015 - European MEMS Summit in Milan, Italy

ATAHOTEL FIERA, Via Keplero 12, 20016 - Pero (Milan)


2-4. Sept. 2015 - Semicon Taiwan in Taipei, Taiwan

Exhibiting with STC (Standard Technology Corporation)
Taipei Nangang Exhibition Center, Hall 1, Booth 610


5-6. August 2015 - MEMS Manufacturing Conference in Santa Clara, California, USA

MEMS Manufacturing 2015
Annual Conference and Exhibition


19-21. May 2015 - Sensor+Test in Nuremberg, Germany

Exhibiting at Booth 12-564 'innovation made in Germany'


05-07. May 2015 - SMT Hybrid Packaging in Nuremberg, Germany

Exhibiting at Booth 6-109A 'Optics Meets Electronics'


22-24. Apr. 2015 - nanomicro biz Japan at Pacifico Yokohama

Exhibiting at Booth A-8 as partner of ADY


10-12. Feb. 2015 - Photonics West, San Francisco, USA

Exhibiting at Booth 4601-41 of the German Pavilion


14-16. Jan. 2015 - ICP NEPCON Japan at Tokyo Big Sight

Exhibiting at Booth E41-13 as partner of ADY


03-05. Dec. 2014 - Semicon Japan at Tokyo Big Sight

Exhibiting at Booth 1058-c of the German Pavilion


07-09. Oct. 2014 - Semicon Europe in Grenoble, France

Exhibiting at Booth 1032 with Silicon Saxony


03-05. Sept 2014 - Semicon Taiwan in Taipei, Taiwan

Exhibiting at Booth 686 with Standard Technology Corporation (STC)


08-10. July 2014 - Semicon West in San Francisco, USA

Exhibiting at Booth 1829 with Silicon Saxony


03-05. June 2014 - Sensor+Test in Nuremberg, Germany

Exhibiting at Booth 12-564 'innovation made in Germany'


06-08. May 2014 - SMT Hybrid Packaging 2014 in Nuremberg, Germany

Exhibiting at Booth 6-215A 'Optics Meets Electronics'

18-20. Mar. 2014 - Laser Optics in Berlin, Germany

Meet us at Laser Optics Berlin at the Berlin Exhibition Grounds
in Berlin, Germany
at the booth of EPIC - European Photonics Industry Consortium


18-20. Mar. 2014 - Semicon China in Shanghai, China

Meet us at Semicon China at the Shanhai New International Expo Centre
in Shanghai, China
at the booth of Standard Technology Corporation (STC)


04-06. Feb. 2014 - Photonics West in San Francisco, USA

Meet us at Photonics West at the Moscone Center
in San Francisco, California, United States
at the German Pavilion, booth 4601


15-17. Jan. 2014 - Nepcon Japan in Tokyo, Japan

Meet us at Nepcon Japan at Tokyo Big Sight
in Tokyo, Japan, at the booth of ADY


05-06. Dec. 2013 - WaferBond Conference in Stockholm, Sweden

Meet us at WaferBond '13 at the KTH Royal Institute of Technology
in Stockholm, Sweden

our contribution:
Anodic Bonding using Evaporated Borosilicate Glass Thin-Films


04-06. Dec. 2013 - SEMICON Japan 2013 in Chiba/Tokyo, Japan

Meet us at SEMICON Japan, Makuhari Exhibition Center, Chiba/Tokyo, Japan
at the German Pavilion
Booth 4C-801b


14-16. Oct. 2013 - MST Kongress 2013 in Aachen, Germany

Meet us at MST Kongress


08-10. Oct. 2013 - SEMICON Europa 2013 in Dresden, Germany

Meet us at SEMICON Europa at the joint stand of Silicon Saxony
Hall 2, Booth 2.050


04-06. Sept. 2013 - SEMICON Taiwan 2013 in Taipei, Taiwan

Meet us at SEMICON Taiwan, TWTC Nangang Exhibition Hall, Taiwan
at the stand of STC - Standard Technology Corporation
Booth 626


28-31. May 2013 - IEEE Electronic Components and Technology Conference (ECTC), Las Vegas, NV, USA

contribution:
Hermetic Wafer-Level Glass Sealing enabling Reliable Low Cost Sensor Packaging


16-18. April 2013 - SMT Hybrid Packaging 2013 in Nuremberg, Germany

Exhibiting at Booth 6-234H 'Optics Meets Electronics'


19-21. March 2013 - Semicon China, Shanghai New International Expo Centre

Exhibiting at Booth #4357 with STC - Standard Technology Corp., Hsin-Chu City, TW


August 2012 - Lithoglas joins Silicon Saxony

MSG Lithoglas GmbH is now member of Silicon Saxony, one of Europe’s most successful associations for the semiconductor, electronic, software, photovoltaic and microsystems industry.


June 2012 - MSG Lithoglas moves into the newly opened NanoCenter in Dresden, Germany

MSG Lithoglas AG located in Berlin and Lithoglas Holding GmbH, Dresden have merged to form MSG Lithoglas GmbH with its headquarters in the newly opened NanoCenter Dresden. Lithoglas will expand its production capacities in Dresden starting from 2013. The Berlin branch will stay fully functional and maintain the accustomed services.


13-16. Nov. 2012 - electronica 2012 in Munich, Germany

Meet us at electronica in Munich, Germany at the joint stand of Innovation made in Germany
Hall 6, Booth 271/10


09-11. Oct. 2012 - SEMICON Europa 2012 in Dresden, Germany

Meet us at SEMICON Europa at the joint stand of Silicon Saxony
Hall 2, Booth 2.050


08-10. May 2012 - SMT Hybrid Packaging 2012 in Nuremberg, Germany

Meet us at SMT Hybrid Packaging in Nuremberg, Germany
Hall 6, Booth 115-M


19-21. Mar. 2012 - microsys berlin 2012 in Berlin, Germany

Meet us at microsys berlin in Berlin, Germany
(conference and trade show / in conjunction with Laser Optics Berlin)


10-12. Oct. 2011 - Mikrosystemtechnik-Kongress 2011, Darmstadt, Germany

contribution:
Hermetic Glass-Thin-Film for Wafer-Level-Packaging of Sensors and ICs


11-13. Oct. 2011 - SEMICON Europa 2011 - Advanced Packaging Conference, Dresden, Germany

contribution:
Low Temperature Glass-Thin-Films for use in Power and Sensor Applications


31. May - 3. June 2011 - The 61st Electronic Components and Technology Conference (ECTC), Lake Buena Vista , Florida, USA

contribution:
Low Temperature Glass-Thin-Films for Use in Power Applications

contribution:
Wafer-Level Glass-Caps for Advanced Optical Applications


11.-13. May 2011 - Symposium on Design, Test, Integration and Packaging of MEMS/MOEMS (DTIP), Aix-en-Provence, France

contribution:
Wafer-Level Glass-Caps for Advanced Optical Applications


03-05. May 2011 - SMT/HYBRID/PACKAGING fair 2011, Nuremburg, Germany

Meet us at our booth 115F in hall 6
Short presentations on our technology in the forum of hall 6 and the forum of hall 9 on May 3rd and 4th





The slides to our presentation are available in our Downloads section


24. Mar. 2011 - MSG Lithoglas adds ISO 9001:2008 Certification

MSG Lithoglas is proud to announce that it has achieved International Standards Organization (ISO) 9001 certification of its quality systems for the research and development, licensing, production and marketing of processes and products in the field of micro-structured materials, particularly glass.


Feb. 2011 - MSG Lithoglas featured in the Fraunhofer Magazine 'weiter.vorn'

Issue 2.11 - GRÜNDERWELT (German):
Robust und wartungsarm mit Glas


13-16. Sept. 2010 - 3rd Electronics System Integration Technology Conference (ESTC), Berlin, Germany

contribution:
Anodic Bonding at Low Voltage using Microstructured Borosilicate Glass Thin-Films

contribution:
Novel Hermetic and Low Cost Glass-Capping Technology for Wafer-Level-Packaging of Optical Devices


17-18. June 2010 - ECPE Workshop, Munich, Germany - ECPE European Center for Power Electronics e.V.

ECPE Workshop on
Power Electronics Substrates - Materials, Performance, Processing and Reliability

contribution:
Highly reliable inorganic Passivation for Power Application


08-10. June 2010 - SMT/HYBRID/PACKAGING fair 2010, Nuremburg, Germany

Meet us at our booth 115A in hall 6
Short presentations on our technology in the forum of hall 6 on June 8th and 9th




5.-7. May 2010 - Symposium on Design, Test, Integration and Packaging of MEMS/MOEMS (DTIP), Sevilla, Spain

contribution:
Hermetic BSG thin film coatings for Harsh Environment Applications

contribution:
Wafer-Level Glass Capping with Optical Integration


22.-24. Mar. 2010 - Laser Optics Berlin, Germany

International Trade Fair and Convention for Optical & Laser Technologies
Contribution to the workshop "MST in Berlin - Mikrooptik"


Oct. 2009 - MSG Lithoglas Company News in Yole's Micronews

October Issue, page 12:
MSG Lithoglas - the benefit of glass




12-14. Oct. 2009 - MST Kongress 2009, Berlin, Germany

Beitrag (S. 349-352):
Plasma-unterstütztes Aufdampfverfahren zur Herstellung Dünner Hermetischer Borosilikatglasschichten im Wafer-Level-Packaging

Treffen Sie uns am Stand 36/37 als Partner des Cluster Mikrosystemtechnik




07. Oct. 2009 - Lithoglas was awarded the EuroAsia IC Industry Awards

More than 100 companies were nominated, more than 25.000 votes were counted in the internet poll.

You voted for us in the category: 'Materials - Improvement Award'
Thanks for your support!


Related Press Release:
MSG Lithoglas AG wins IC Industry Award 2009 for “Materials Improvement”


06-08. Oct. 2009 - Semicon Europe 2009, Dresden, Germany, as Partner of Fraunhofer IZM

Meet us in hall 4 at booth 4.012



06-09. Sept. 2009 - EuroSensors XXIII, Lausanne, Switzerland

contribution (p. 76-79):
Robust and Hermetic Borosilicate Glass Coatings by E-Beam Evaporation

contribution (p. 1527-1530):
A Hermetic Advanced Packaging Solution for Optical Devices Using a Glass-Capping Technology on Wafer-Level


July 2009 - Lithoglas is short-listed for the EuroAsia IC Industry Awards

MSG Lithoglas AG was nominated and short-listed in the category
'Materials - Improvement Award'
among Applied Chemicals Laboratories, Entegris Inc., and K-Patents

The awards winners will be chosen by online-vote on the EuroAsia web-site

15-18. Jun. 2009 - European Microelectronics and Packaging Conference (EMPC), Rimini, Italy

contribution:
Thin Hermetic Borosilicate Glass Layers for Highly Reliable Chip-Passivations in Wafer-Level-Packaging


June 2009 - Publication on our technology in the June issue of mst|news

We are part of the June mstnews issue on "Packaging, Interconnection and Assembly", core issues of Smart Systems Integration

Title: "Hermetical Micro-structured Glass Layers for Highly Reliable Advanced Packaging Applications"
page 10, mst|news 03/09






26-29. May 2009 - 59th Electronic Components and Techn. Conf. (ECTC), San Diego, USA

contribution:
Thin Hermetic Passivation of Semiconductors using Low Temperature Borosilicate Glass – Benchmark of a New Wafer-Level Packaging Technology


05-07. May 2009 - SMT/HYBRID/PACKAGING fair 2009, Nuremburg, Germany

Meet us at our booth 424F in hall 6
Short presentations on our technology in the forum of hall 6 on May 5th and 6th








30. Apr. 2009 - MSG Lithoglas referenced in the Annual Report 2008/2009 of Fraunhofer IZM

Berlin researchers are revolutionizing microelectronics by microstructuring glass
With a project developing thin-glass deposition onto substrates, so-called "additive microstructuring of glass, researchers from the company MSG Lithoglas AG and Fraunhofer IZM have been shortlisted for this years's Berlin-Brandenburg Innovation Award. The micro- and even nanometer layers could revolutionize countless applications in opto- and microelectronics.
read more


01. Apr. 2009 - MSG Lithoglas Firmenvorstellung im Kompetenznetz für Optische Technologien in Berlin-Brandenburg - OpTecBB

22. Jan. 2009 - MSG Lithoglas Company News in Yole's Micronews

January Issue, 3D-Packaging, page 6:
Additive microstructuring of glass exclusively licensed from SCHOTT AG





13. Nov. 2008 - MSG Lithoglas AG is finalist for the award for innovation 2008 of Berlin/Brandenburg.
Lithoglas was chosen from over 140 applicants by a renowned committee to be a finalist among six other companies of the 2008 Innovation Award of Berlin/Brandenburg.

Innovation: Additive Mikrostrukturierung von Glas
Beschreibung: Glas besitzt zahlreiche Eigenschaften, die es als Werkstoff für elektronische optische Bauteile prädestiniert. Aber Glas ist spröde und nur aufwändig mechanisch zu bearbeiten. Bisherige entsprechende Verfahren haben große Nachteile wie Verlust guter optischer Eigenschaften, hohe Prozesstemperaturen und hohe Kosten durch lange Prozesszeiten. Die Innovation ist ein neues Verfahren zur Erzeugung dünner Glasschichten bei Temperaturen unter 120oC. Damit können temperaturempfindliche Bauteile mit Glas dünn beschichtet werden. Gleichzeitig können die Glasschichten mit photolithographischen Verfahren strukturiert werden. Für diese Innovation ist die Bemusterung für erste Anwendungen erfolgt, die Verwertung des Verfahrens wird aktuell vorbereitet. Anwendungen für die Bereiche Automobil- und Medizintechnik, für Drucksensoren und das Packaging von optischen Komponenten von BlueRay-Applikationen erscheinen aussichtsreich.