Meet us:


Santa Clara, CA, USA
Aug 2 - 3


Grenoble, France
Sept 20-22
Booth 12
Our Technology

Glass Deposition - Lithoglas unique hermetic glass thin films
The fundamental aspect of the technology is the deposition of a structured borosilicate glass layers at low temperatures employing photolithographic lift-off-processing.
Borosilicate glass is an excellent moisture barrier material with very low moisture uptake. It is a hard, temperature-stable and exhibits excellent transparency in the visible spectrum, making it the material of choice for long-term reliable encapsulation or sealing of devices and surface materials.
The deposition is a low-temperature process and fully CMOS-compatible.
Due to their optical characteristics, the glass films are especially suitable for opto-electronic applications as e.g. imagers and detectors as well as light sources like semiconductor lasers or LEDs.
By applying borosilicate glass layers chip surfaces can be hermetically sealed on wafer-level. This allows for cost-optimized packaging solutions as the complexity to yield hermetic packages may be reduced.
In MEMS the borosilicate glass thin films can be employed to enable the anodic bonding of substrates, e.g. silicon to silicon or other material combinations.
The Lithoglas glass deposition process is available as contract service.

Wafer Bonding - Lithoglas permanent bonding techniques
Lithoglas uses state of the art equipment in making its capping solutions. Our bonding capabilities include aligned and non-aligned bonding employing anodic, direct and glue bond processing.
Permanent hermetic bonding is facilitated by using Lithoglas’ unique glass deposition technology for forming thin anodic bond glass films. Thin films of a few micrometer thickness are sufficient for making materials and surfaces fit for the anodic bonding process.
All Lithoglas bonding processes are available as contract service.

Wet Chemical Structuring - Formation of Spacer and Cavity Structures
Lithoglas employs mainly wet chemical structuring processes for defining spacer and cavity structures of very high precision as used in making micro caps for optoelectronics, fluidic structures of MEMS packaging substrates.
Typical materials structured by Lithoglas wet chemical processes are silicon and different glass materials. For creating highly precise glass micro-structures on a wide range of different surfaces Lithoglas’ unique glass deposition technology can be employed – avoiding wet chemical etching by applying very gentle lift-off processing.
All Lithoglas wet chemical structuring processes are available as contract service.