High Quality Opto- and Fingerprint-Sensors

 

Lithoglas® Thin Film Passivation

  • Enhanced optical performance (very thin glass, no glue)
  • Highly precise structuring by lithography
  • Excellent manufacturing yields by e.g. avoiding thin wafer handling, glue processing, wafer thinning on glue layer, dicing through glass substrate, and more
  • Small COB device with high reliability

Coating MaterialBorosilicate Glass
Film Thickness≥ 0.1 µm, ≤ 20 µm
Thermal Expansion~ 3 ppm/K
Optical transmissionapprox. 330 nm to 3000 nm
Deposition Temperature< 80°C
Conformal Coatingno
Structuring MethodLift-Off / Shadow Mask / Etching
Aspect Ratio≤ 1 (for Lift-Off)
Side Wall Angle~ 60°
Wafer FormatsSEMI Std. 100 mm, 150 mm, 200 mm dia.

 

Typ. ApplicationsSurface Passivation
Moisture Barrier
Andoic Bond Layer

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