High Quality Opto- and Fingerprint-Sensors
Lithoglas® Thin Film Passivation
- Enhanced optical performance (very thin glass, no glue)
- Highly precise structuring by lithography
- Excellent manufacturing yields by e.g. avoiding thin wafer handling, glue processing, wafer thinning on glue layer, dicing through glass substrate, and more
- Small COB device with high reliability
Coating Material | Borosilicate Glass |
Film Thickness | ≥ 0.1 µm, ≤ 20 µm |
Thermal Expansion | ~ 3 ppm/K |
Optical transmission | approx. 330 nm to 3000 nm |
Deposition Temperature | < 80°C |
Conformal Coating | no |
Structuring Method | Lift-Off / Shadow Mask / Etching |
Aspect Ratio | ≤ 1 (for Lift-Off) |
Side Wall Angle | ~ 60° |
Wafer Formats | SEMI Std. 100 mm, 150 mm, 200 mm dia. |
Typ. Applications | Surface Passivation Moisture Barrier Andoic Bond Layer |
For additional information or differing specifications please contact us.