The 10th IEEE Electronics System-Integration Technology Conference (IEEE ESTC 2024) is the premier international event in the field of electronics packaging and system integration. The conference is organized every two years in Europe and is supported by IEEE-EPS in association with IMAPS Europe. The 10th IEEE ESTC will be taking place in Berlin, Germany.

Be sure not to miss our contribution:
Array Packaging with Integrated Mirrors for High Power Multi-chip UVC-LED Modules,
Wednesday Sep 11, 2:40pm, Opto1_Photonic Module Packaging

Looking forward to meet you there!