Wafer Bonding

Lithoglas permanent bonding techniques

Lithoglas uses state of the art equipment in making its capping solutions. Our bonding capabilities include aligned and non-aligned bonding employing anodic, direct and glue bond processing.

Permanent hermetic bonding is facilitated by using Lithoglas’ unique glass deposition technology for forming thin anodic bond glass films. Thin films of a few micrometer thickness are sufficient for making materials and surfaces fit for the anodic bonding process.

All Lithoglas bonding processes are available as contract service.