Maximizing UV-C Light Extraction Efficiency

Lithoglas® Caps for DUV applications increase light output, have excellent thermal behavior and allow for hermetic, SMD-type packages of UV-C LEDs or LED arrays.

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Small & Hermetic: Laser Diode Caps for SMD Packaging

Lithoglas® Caps with integrated 45° mirror redirecting side-emitted light towards the top of the package with excellent thermal behaviour – available also in array format

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High Quality Opto- and Fingerprint Sensors

Lithoglas® Hermetic Thin-Glass Sealing for thinnest, hermetic protection of semiconductor surfaces with excellent optiacl performance at highest reliability

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High Reliability Image Sensor Package

Lithoglas® Cavity Windows for Wafer-Level- or COB-Packaging with excellent reliability
– fit for large size image sensors

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High Accuracy Full Silicon Pressure Sensors

Silicon-to-Silicon anodic bonding enabled by Lithoglas® glass film deposition with excellent bond strength yielding highest signal quality

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Application Features

Anodic Bonding

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Lithoglas® uses state of the art equipment in making its capping solutions. Our bonding capabilities include aligned and non-aligned bonding employing anodic, direct and glue bond processing. Read more

Product Features

Metallized Windows

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Lithoglas® Flat Windows for hermetic COB-packaging are available for ultraviolet, visible and infrared applications. We offer highly reliable high performance optical coatings combined with solderable metallizations e.g. for AuSn- or SAC-soldering. Our wafer-level production process guarantees high volume scalability. Read more