Lithoglas’ technology portfolio – focus on hermetic encapsulations
Based on the unique low temperature deposition process for hermetic thin films, Lithoglas offers a set of technologies fit for hermetic encapsulation of electronic components like opto-sensors, MEMS and others.
Lithoglas permanent bonding techniques
Lithoglas uses state of the art equipment in making its capping solutions. Our bonding capabilities include aligned and non-aligned bonding employing anodic, direct and glue bond processing. Read more
Wet Chemical Structuring – formation of spacer and cavity substrates
Lithoglas employs mainly wet chemical structuring processes for defining spacer and cavity structures of very high precision as used in making micro caps for optoelectronics, fluidic structures of MEMS packaging substrates. Read more