Processes and Materials

Overview of our Capabilities

Lithoglas operates wafer fab cleanrooms offering a broad range of equipment and material capabilities.

  • Cleanroom Class 10 and 1000
  • Wafer Sizes: 200mm, 150mm, 100mm (not supported in all processes)

  • Wafer Cleaning (wet, dry)
  • Wet Etching of Silicon and Glass
  • Laser Structuring of Borosilicate and Silica Glasses
  • CD Microscopes, Automatic Optical Inspection, Thickness Measurement, Profilometer
  • PVD Deposition of Borosilicate Glass, SiO2 and Al2O3
  • Lithography – Spin-On and Spray Resist Coating (positive and negative tone)
  • Lithography – Mask Alingment (front and backside, 2 mic resolution)
  • Wafer Bonding (Anodic and Fusion)
  • Metal Deposition of Al, Cr, CrNi, Au, WTi
  • Thermal Oxide Deposition
  • LPCVD and PECVD Silicon Nitride deposition
  • Wafer Dicing