Processes and Materials

Overview of our Capabilities

Lithoglas operates wafer fab cleanrooms offering a broad range of equipment and material capabilities.

• Cleanroom Class 10 and 1000
• Wafer Sizes: 200mm, 150mm, 100mm (not supported in all processes)

• Wafer Cleaning (wet, dry)
• Wet Etching of Silicon and Glass
• Laser Structuring of Borosilicate and Silica Glasses
• CD Microscopes, Automatic Optical Inspection, Thickness Measurement, Profilometer
• PVD Deposition of SiO2 and Al2O3
• Lithography – Spin-On and Spray Resist Coating (positive and negative tone)
• Lithography – Mask Alignment (front and backside, 2 mic resolution)
• Wafer Bonding (Anodic and Fusion)
• Metal Deposition of Al, Cr, CrNi, Au, WTi
• Thermal Oxide Deposition
• LPCVD and PECVD Silicon Nitride deposition
• Wafer Dicing