Meet us:


Santa Clara, CA, USA
Aug 2-3


Grenoble, France
Sept 20-22
Booth 12
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>>  Technology Presentation - Hermetic Packaging Solutions Using Glass
A brief overview on our technology and its applications

>>  Hand-Out - Lithoglas® Surface Passivation
Lithoglas® micro-structured coatings can be used as surface passivation for the hermetic sealing of sensitive chip areas. Lithoglas® coatings are excellent moisture barriers applied on wafer-level under clean-room conditions, enabling low-cost plastic-molded COB packaging with high reliability.

>>  Hand-Out - Lithoglas® Cavity Substrates
Lithoglas® micro-structured cavity substrates are manufactured according to your design with high precision either as a full glass solution or a silicon-glass hybrid for larger cavity heights. The integration of optical features like coatings and apertures is standard. The glass caps are typically used in wafer-level or COB-packaging.

>>  Hand-Out - Glass Structures for Anodic Bonding
Lithoglas® micro-structured glass films are usable as interface layers for the highly stable joining of substrates by anodic bonding. They can be deposited on various substrates to achieve hermetic cavities, channels or other structures.

>>  Hand-Out - Glass Cavity Substrates for WLCSP
Lithoglas® micro-structred glass substrates are manufactured on wafer-level and can be integrated beneficially in existing packaging technologies to improve reliability and device lifetime while reducing the package dimension.

>>  Press Release - Lithoglas Awarded the Deloitte Fast 50 for 2015
Lithoglas® - Manufacturer of ultra-thin glass for opto-electronic sensors, LEDs, and MEMS components recognized for marketing leadership and innovation.
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